FPC00024
Keesun
FPC00024
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Flexible printed circuit boards are printed circuits made of flexible insulating substrates, which have many advantages that hard printed circuit boards do not have:
1. It can be freely bent, wound and folded, arbitrarily arranged according to the spatial layout requirements, and arbitrarily moved and expanded in three-dimensional space, so as to achieve the integration of component assembly and wire connection;
2. The use of FPC can greatly reduce the size and weight of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras and other fields or products.
3. FPC also has good heat dissipation and weldability, as well as the advantages of easy installation and low comprehensive cost, and the combination of soft and hard design also makes up for the slight deficiency of the flexible substrate in the bearing capacity of the component to a certain extent.
Flexible printed circuit boards are printed circuits made of flexible insulating substrates, which have many advantages that hard printed circuit boards do not have:
1. It can be freely bent, wound and folded, arbitrarily arranged according to the spatial layout requirements, and arbitrarily moved and expanded in three-dimensional space, so as to achieve the integration of component assembly and wire connection;
2. The use of FPC can greatly reduce the size and weight of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras and other fields or products.
3. FPC also has good heat dissipation and weldability, as well as the advantages of easy installation and low comprehensive cost, and the combination of soft and hard design also makes up for the slight deficiency of the flexible substrate in the bearing capacity of the component to a certain extent.